Boron Materials in Semiconductor Packaging: Small Ingredient, Significant Impact

In semiconductor manufacturing, every tiny step is related to the reliability of the chip. Boron materials, although used in small quantities, play an irreplaceable role in packaging processes.

Electronic grade boron oxide can be used for P-type doping to regulate the conductivity of silicon wafers; Boric acid is widely used in electronic pastes as a glass fluxing agent to enhance the bonding strength between electrodes and substrates, ensuring stable signal transmission.

The high-purity boric acid and boron oxide produced by Youbo New Materials comply with strict enterprise standards (Q/TY-J08.04-2010), have low heavy metal content, high batch consistency, and have passed the process validation of multiple semiconductor packaging factories.

We not only provide materials, but also offer technical support to assist customers in optimizing sintering processes and improving product yield. Against the backdrop of accelerated domestic substitution, Yoobor is willing to become a trusted material partner in the semiconductor industry chain.